LASER MARKING AND CLEANING SYSTEMS
BENEFITS
- High Speed (> 40% than conventional equipment)
- Fully Stable Top Marking Quality by Bend less system
- Extremely Reduced Footprint
- Zero Setup time
- Import from DXF
- APL – Automatic Panel Learning
- ALPF – Automatic Laser Parameters Finder
- Recipe development in 5 minutes
- Affordable Price
FEATURES
- Top / Bottom Marking
- Up to 410mm Panels (Optional 650mm)
- Optical Fiducial Check
- High Accuracy (125um spot size / 5 mils)
- Marking Quality Check
- Bad Mark check
- OCR Check
- 24″ Intutitive Touch Screen HMI
- In line Smema compliant
- Industry 4.0 compliant & Remote control
- MES Personalization Available
CONFIGURATIONS
- Top Side Marking F350
- Bottom Side Marking F450
- Lighting (up to 650mm panels)
- Semicon (DBCs and Mastercard)
- Metals or Plastics parts F350F
- F800 (up to 650 x 650mm panels)
FUTURA PLATFORM
- Marks on all colours of solder mask
- Fast markings avg time: 0.4 s per DMC)
- Allows solder mask removal frequently requested on white PCBs
- Marks on metal and plastic
- Allows solder mask removal to reveal copper layer on PCBs